WDS-900 BGA Rework Station

Machine size L830 × W1110 × H1740mm
Applicable PCB size Max760 × 630mm Min 10 × 10 mm
Applicable chip size Max120 × 120mm Min 0.6 × 0.6mm
Applicable pin pitch ≧0.3mm
Applicable PCB thickness 0.3-8mm

Description

WDS-900 is a BGA repair station developed and designed for large server motherboards; With optical alignment system, infrared plus gas (including nitrogen or compressed air) mixed heating mode is adopted, and all actions are driven by motor and controlled by software. Used for desoldering chips of various packaging forms. It is applicable to any BGA device, special and highly difficult to repair components POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames).

Power supply Ac380v±10%,50/60hz
Total Power 9500W
Heater power Upper hot air heating, maximum 1600W
Lower hot air heating, maximum 1600W
Bottom infrared preheating, maximum 6000w
PCB positioning method V-shaped slot+universal clamp
Temperature control method High precision K-type thermocouple closed loop control, independent upper and lower temperature measurement, temperature accuracy can reach plus or minus 2 degrees;
Electrical selection material Industrial computer+temperature control module+motion control card+servo driver
Applicable PCB size Max760 × 630mm Min 10 × 10 mm
Applicable chip size Max120 × 120mm Min 0.6 × 0.6mm
Applicable pin pitch ≧0.3mm
Applicable PCB thickness 0.3-8mm
Alignment system Optical diamond mirror+high-definition industrial camera
Mounting accuracy ±0.025mm,
Temperature measurement interface 5
Maximum load for mounting 150G
Solder point monitoring External camera monitors the solder ball melting process during welding (optional)
MES system Reserved MES port
Feeding device Automatic feeding device
Machine size L830 × W1110 × H1740mm
Machine weight About 230kg
Other Features Double rocker operation, automatic/manual mode free switching, 7-axis electric motion control, original dual channel heating technology PCB preheating in advance, MES port; Smoke purification system

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