WDS-900 BGA Rework Station

Machine size L830 × W1110 × H1740mm
Applicable PCB size Max760 × 630mm Min 10 × 10 mm
Applicable chip size Max120 × 120mm Min 0.6 × 0.6mm
Applicable pin pitch ≧0.3mm
Applicable PCB thickness 0.3-8mm

WDS-900 is a BGA repair station developed and designed for large server motherboards; With optical alignment system, infrared plus gas (including nitrogen or compressed air) mixed heating mode is adopted, and all actions are driven by motor and controlled by software. Used for desoldering chips of various packaging forms. It is applicable to any BGA device, special and highly difficult to repair components POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames).

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