WDS-750 BGA Hot Air Soldering Rework Station

Machine size 670mm(L)*780mm(W)*850mm(H)
Max. PCB size 550×480mm
Min. PCB size 10×10mm
Location way Optical camera+ V-shape card slot + laser position for fast location

Description

WDS-750 BGA Hot Air Soldering Rework Station

1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;
2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield; 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;
4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;
5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;
6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃;
7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;
8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;
9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;
10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).
Item WDS-750
Total power 6800W
Upper heating power 1200W
Bottom heating power 1200W
Bottom IR heating power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Location way Optical camera+ V-shape card slot + laser position for fast location
Temperature control High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision
Appliance selection High sensitive touch screen + temperature control mode +Panasonic PLC +step driver
Max. PCB size 550×480mm
Min. PCB size 10×10mm
Thermo-couple Ports 4pcs
Chip amplification times 2-30
PCB thickness 0.5-8mm
Chip size 0.3*0.6mm-80*80mm
Min. chip space 0.15mm
Max. mount loading 200g
Mount precision ±0.01mm
Machine size 670mm(L)*780mm(W)*850mm(H)
Optical camera Can be removed front and back,left and right,prevent the dead angle
Machine weight About 90KG

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