BGA Hot Air Soldering Rework Station Technical Parameters
| Total power | 6800W |
| Upper heating power | 1200W |
| Bottom heating power | 1200W |
| Bottom IR heating power | 4200W（2400W is controlled） |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Location way | Optical camera+ V-shape card slot + laser position for fast location |
| Temperature control | High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision |
| Appliance selection | High sensitive touch screen + temperature control mode +Panasonic PLC +step driver |
| Max. PCB size | 570×450mm |
| Min. PCB size | 10×10mm |
| Sensor | 4units |
| Chip amplification multiple | 2-30X |
| PCB thickness | 0.5-8mm |
| Chip size | 0.3*0.6mm-80*80mm |
| Min. chip space | 0.15mm |
| Max. mount loading | 200g |
| Mount precision | ±0.01mm |
| Overall size | L670×W780×H850mm |
| Optical camera | Can be removed front and back,left and right,prevent the dead angle |
| Machine weight | 90kg |
BGA Hot Air Soldering Rework Station Key Features
1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;
2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield; 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;
4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;
5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;
6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃；
7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;
8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;
9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;
10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).
