Wafer Cleaning Machine
Mainly used for cleaning of high-end wafer dust, as follows.
| Item | KY-650 |
| Machine size | 700mm(L)*650mm(W)*1100mm(H) |
| Cleaning Tray Specifications | 4-12 inches(optional) |
| Cleaning tray size | Can be customized |
| Pure water inlet diameter | Outside diameter 8mm pure water hosel |
| Discharge diameter | 3/4 hose |
| Air inlet diameter | PU 8mm trachea |
| Exhaust port diameter | 1.5″ |
| Power supply | AC220V 50HZ:5A |
| Power | Rated power:1.5KW,Total power:2KW |
| Power consumption | When cleaning:15kw/h, Standbytime:0.5kw/h |
| Air supply | 0.45-0.7Mpa， |
| DI water supply | >0.35Mpa |
| Centrifugal speed | 0-2500R/Min |
| Drive horsepower | 1HP |
| Pure water consumption | 0-1000ML/Min |
| Gas consumption | 200-500L/Min |
| Air filtration method | 0.01μ m |
| Machine weight | About 180KG |
Wafer Cleaning Machine
- Used in Wafer, CMOS-body, substrate, CCD case dust, impurities. Holder, Holder + IR, Lens, VCM and other removal operations.
- replaceable cleaning suction cups, can use 4-12 inches of cleaning suction cups.
- operating procedures can be prepared and adjusted according to operational needs, the equipment running process, cleaning time and the parameters can be prepared by themselves.
- online real-time monitoring of equipment operating status and parameters, automatic door with safety grating to ensure operational safety.
- Adopt vacuum adsorption cleaning plate, the wafer jig is safer and more convenient to take and put.
- swing-arm cleaning, cleaning range can be prepared, wide range of application, no cleaning blind area, no secondary pollution, better cleaning effect.
- High-speed centrifugal design, speed can be adjusted 100-2000R/Min.
