Description

Mainly used for cleaning of high-end wafer dust, as follows.

1. Used in Wafer, CMOS-body, substrate, CCD case dust, impurities. Holder, Holder + IR, Lens, VCM and other removal operations.
2. replaceable cleaning suction cups, can use 4-12 inches of cleaning suction cups.
3. operating procedures can be prepared and adjusted according to operational needs, the equipment running process, cleaning time and the parameters can be prepared by themselves.
4. online real-time monitoring of equipment operating status and parameters, automatic door with safety grating to ensure operational safety.
5. Adopt vacuum adsorption cleaning plate, the wafer jig is safer and more convenient to take and put.
6. swing-arm cleaning, cleaning range can be prepared, wide range of application, no cleaning blind area, no secondary pollution, better cleaning effect.
7. High-speed centrifugal design, speed can be adjusted 100-2000R/Min.