KY-300 Medium Wave Soldering Machine Mainly used in industries such as electronics manufacturing, communication equipment manufacturing, instrument and meter manufacturing, and automotive electronics manufacturing.
| Model | KY-300M | KY-300ML |
| Dimensions | L2900xW1200xH1650MM | L3500xW1200xH1700MM |
| Rack Size | L2200xW1250xH1650MM | L2800xW1250xH1700MM |
| Pcb Board Width | Max:50-300mm | |
| Pcb Board Transportation Helgh | 750+20mm | |
| Pcb Board Transportation Speed | 0-1800mm/min | |
| Pcb Board Welding Angle | 3-7度3-7° | |
| Pcb Board Transportation Direction | L→R/R→L(optional) | |
| Component Height Limit On PCB Boardv |
Max:110mm | |
| Peak Height Range | 0- 12mm Adjustable | |
| Number Of Peaks | 2 | |
| Preheating Zone Length | 950MM/HotAir /Infrared (optional) | 1500MM/ Hot Air/ Infrared (optional |
| Number Of Preheating Zones | 2 | 3 |
| Preheating Zone Power | 6kw | 9kw |
| Preheating Zone Temperature | Room temperature 250℃,which can be set | |
| Heating Method | Hot air /infrared(optional) | |
| Number Of Cooling Zones | 1 | |
| Coollng Method | Computer fan cooling | |
| Applicable Solder Type | lead-free solder/ordinary solder | |
| Tin Furnace Power | 9kw | 10kw |
| Dissolved Tin In Tin Fumace | Approx :250KG | Approx .300KG |
| Stove Temperature | Room temperature-300℃,control accuracy ±1-2℃ | |
| Temperature Control Method | P,I.D+SSR | |
| Machine Control Method | ndependent PLC+Brand/computer/touch screen buttons | |
| Flux Capacity | Max:5.2L | |
| Flux Flow | 10~100ml/min | |
| Spray Method | Stepper motor/+ST-6spraye | |
| Power Supply | 3sohase and 5-line mechanism 380V | |
| Total Power | max:16kw | Max.20kw |
| Normal Operating Power | Approx:3kw | Approx:4kw |
| Gas Source | 4~7KG/CM² | |
| Welght | Approx:800kg | Approx.1000kg |
Control system: Industrial touch screen+PLC+SSR control, man-machine dialogue function, with functions such as parameter setting, function operation, production counting, economical intelligent welding function.
Transportation system: The clause adopts a turbo-worm structure. The adjustment is stable, accurate and convenient. Synchronous board connection, the guide rail adopts a special process design to prevent the guide rail from deformina. Titanium alloy transport claws, reinforced wear-resistant stainless steel imitating deformation device. Titanium claws are automatically tensioned without deformation.
Spray system: The spray system is controlled by an SMC cylinder and the spray speed is automatically adiusted with the width of the PCB and the transportation speed. Imported high-density nozzles are used to ensure the uniformity of the spray. Optional flux recovery system to ensure environmental protection and health.
Solder furnace: lead-free furnace chamber, long life and high thermal stability. Adopt patented nozzle design, oxidation ≤ 2kg (8h), suitable for Sn/Ag/Cu, Sn/Cu and other kinds of lead-free solder soldering process, unique dross collection design, easy maintenance, tin furnace temperature control accuracy ± 1 ℃. The wave adopts infinitesimal frequency speed regulation and delayed start design to make the wave start more smoothly and the wave more flat.
Preheating system: Preheating system adopts hot air circulation preheating structure, modular design, precise temperature control, can meet the lead-free process curve of single-layer or multi-layer board with jig, drawer type design, more convenient maintenance
Cooling system: using forced air cooling, high-power fan design, cooling rate up to 4-6℃/s
KY-300 Medium Wave Soldering Machine
