KY-250 Mini Wave Soldering Machine
| Model | KY-250M | KY-250ML |
| Rack size | L1450×W1050×H1400mm | L1800×W1050×H1400mm |
| Dimensions | L2250*W1100*H1600±20MM | L2600*W1100*H1600±20MM |
| Adjustable width of PCB board | Max.50-250mm | |
| PCB board transportation height | 750±20mm | |
| PCB board transportation speed | 0-1800mm/min | |
| PCB board welding angle | 3-7° | |
| PCB board transportation direction | L→R/R→L(optional) | |
| Height on PCB | Max.100mm | |
| Peak height range | 0-12mm Adjustable | |
| Number of peaks | 2 | |
| Preheating zone length | 700mm | 950mm |
| Number of preheating zones | 2 | |
| Preheating zone power | 6kw | 7kw |
| Preheating zone temperature | Room temperature 250℃ | |
| heating method | Hot air /infrared(optional) | |
| Applicable solder type | lead-free solder/ordinary solder | |
| Tin furnace power | 5kw | 6kw |
| Dissolved tin in tin fumace | Approx .130KG | Approx .180KG |
| Stove temperature | Indoor temperature-300℃ | |
| temperature control method | P,I.D+SSR | |
| Machine control method | Independent PLC+touch screen | |
| Flux capacity | Max5.2L | |
| Flux flow | 10~100ml/min | |
| spray method | Stepper motor | |
| power supply | 3sohase and 5-line mechanism 380V | |
| total power | Max.12kw | Max.14kw |
| nomal operating power | Approx.2kw | Approx.3kw |
| Gas source | 4~7KG/CM2 | |
| welght | Approx,400kg | Approx.500kg |
Control system: Industrial touch screen+PLC+SSR control, man-machine dialogue function, with functions such as parameter setting, function operation, production counting, economical intelligent welding function.
Transportation system: The clause adopts a turbo-worm structure. The adjustment is stable, accurate and convenient. Synchronous board connection, the guide rail adopts a special process design to prevent the guide rail from deformina. Titanium alloy transport claws, reinforced wear-resistant stainless steel imitating deformation device. Titanium claws are automatically tensioned without deformation.
Spray system: The spray system is controlled by an SMC cylinder and the spray speed is automatically adiusted with the width of the PCB and the transportation speed. Imported high-density nozzles are used to ensure the uniformity of the spray. Optional flux recovery system to ensure environmental protection and health.
Solder furnace: lead-free furnace chamber, long life and high thermal stability. Adopt patented nozzle design, oxidation ≤ 2kg (8h), suitable for Sn/Ag/Cu, Sn/Cu and other kinds of lead-free solder soldering process, unique dross collection design, easy maintenance, tin furnace temperature control accuracy ± 1 ℃. The wave adopts infinitesimal frequency speed regulation and delayed start design to make the wave start more smoothly and the wave more flat.
Preheating system: Preheating system adopts hot air circulation preheating structure, modular design, precise temperature control, can meet the lead-free process curve of single-layer or multi-layer board with jig, drawer type design, more convenient maintenance
Cooling system: using forced air cooling, high-power fan design, cooling rate up to 4-6℃/s
KY-250 Mini Wave Soldering Machine
