KY-7000 3D AOI
|Machine size||L1125mm*D1360mm*H1570mm(exchuding lamp)|
|X/Y motion||AC servo double drive|
|Camera||12MP industrial camera|
|Detected PCB Size||50*60-510*510mm|
|Detected PCB Thickness||0.6-6.0mm|
KY-7000, adopts a new generation of multi projector optical machine technology, which can effectively solve the shadow blind spots and truly restore components.
1,3D positioning technology and FOV positioning are adopted to accurately position components and pads, which are not affected by incoming material changes.
2,The perfect combination of 3D technology and color feature algorithm can effectively detect the defects of components and solder joints.
3,Automatic compensation for bending, which can deal with flexible boards and circuit boards deformed due to high temperature.
4,The analysis of rich SPC detection data is helpful to improve and enhance the process quality.
5,Three points of illumination and function can quickly locate the root cause of defects.
|Equipment Model||KY-7000(Single Track)||KY-7000(Double Track)||KY-7000XL(Enlarged Double Track)|
|Imaging system||Camera||12MP industrial camera|
|Light source||4-color ring programmable LED light source(RGBW)|
|Height measurement method||Structural grating * 4|
|Plate Feeding Mechanism||X/Y motion||AC servo double drive|
|Track width adjustment mode||Automatic adjustment|
|Inlet flow direction||Left → right or right → left(factory setting)|
|Fixed rail||Monorail 1 rail fixed,double gauge: 1 rail fixed(1/3 or 1/4 fixed)|
|Hardware Configuration||Operating system||Win10|
|Power Supply||Single-phase 220V,50/60Hz,5A|
|Machine size||L1125mm*D1360mm*H1570mm(exchuding lamp)||L1295*D1360*H1570mm(excluding lamp)|
|Detected PCB Specifications||Size||50*60-510*510mm||Double track:50*60-510*320mm
|Clear height||The upper clear height is 25-50mm, and the lower clear height is 45mm|
|Test Items||Component class||Misalignment, missing parts, polarity, deviation, turnover, damage,IC corner,IC warping., foreign matter, floating height, tilt, etc|
|Solder||No tin,less/more tin, faulty soldering, bridging, tin ball, etc|
|Check elements||Chip:03015 and above(3D),LSI:0.3mm spacing and above, others: special-shaped components|
|Detection Capablity||Height resolution||0.37μm|