UV Laser Marking Machine


It is mainly used for superfine marking and engraving, especially suitable for marking and microporous of food and medicine packaging materials (such as plastics), high-speed division of glass and porcelain materials, and complex pattern cutting of silicon wafer.





UV Laser Marking Machine PRODUCT FEATURES

The ultraviolet laser marking machine is developed by 355nm ultraviolet laser. Compared with the infrared laser, the third-order intracavity frequency doubling technology adopted in the machine can directly break the molecular chain of the material by short wavelength laser, greatly reducing the mechanical deformation of the material. Although it is heated, it is cold light


model KY-UV-3/5/10/15W
maximum power 3/5/10/15W
frequency range 10-100KHz
Pulse width range 13-80ns
Laser wavelength 355nm
Carving range 150mmx150mm(optional)
Engraving speed <7000mm/s
Repeatability ±0.1pm
Beam diameter 0.8mm
Cooling mode water cooling



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