The ultraviolet laser marking machine is developed by 355nm ultraviolet laser. Compared with the infrared laser, the third-order intracavity frequency doubling technology adopted in the machine can directly break the molecu­lar chain of the material by short wavelength laser, greatly reducing the me­chanical deformation of the material. Although it is heated, it is cold light.

APPLICABLE MATERIALS: It is mainly used for superfine marking and engraving, especially suitable for marking and microporous of food and medicine packaging materials (such as plastics), high-speed division of glass and porcelain materials, and com¬plex pattern cutting of silicon wafer.

model LS-UV-3/5/10/15W
maximum power 3/5/10/15W
frequency range 10-100KHz
Pulse width range 13-80ns
Laser wavelength 355nm
Carving range 150mmx150mm(optional)
Engraving speed <7000mm/s
Repeatability ±0.1pm
Beam diameter 0.8mm
Cooling mode water cooling

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