DIP Wave Soldering equipment

KY-300 Medium Wave Soldering Machine is a wave soldering machine designed for PCB widths below 300mm  The length of the preheating zone can be selected from 950/1500mm 。

This machine is touch screen controlled, and can also be controlled by computer

KY-300 DIP Wave Soldering equipment Mainly used in industries such as electronics manufacturing, communication equipment manufacturing, instrument and meter manufacturing, and automotive electronics manufacturing.

Model KY-300M KY-300ML
Dimensions L2900xW1200xH1650MM L3500xW1200xH1700MM
Rack Size L2200xW1250xH1650MM L2800xW1250xH1700MM
Pcb Board Width Max:50-300mm
Pcb Board Transportation Helgh 750+20mm
Pcb Board Transportation Speed 0-1800mm/min
Pcb Board Welding Angle 3-7度3-7°
Pcb Board Transportation Direction L→R/R→L(optional)
Component Height Limit On
PCB  Boardv
Peak Height Range 0- 12mm Adjustable
Number Of Peaks 2
Preheating Zone Length 950MM/HotAir /Infrared (optional) 1500MM/ Hot Air/ Infrared (optional
Number Of Preheating Zones 2 3
Preheating Zone Power 6kw 9kw
Preheating Zone Temperature Room temperature 250℃,which can be set
Heating Method Hot air /infrared(optional)
Number Of Cooling Zones 1
Coollng Method Computer fan cooling
Applicable Solder Type lead-free solder/ordinary solder
Tin Furnace Power 9kw 10kw
Dissolved Tin In Tin Fumace Approx :250KG Approx .300KG
Stove Temperature Room  temperature-300℃,control  accuracy  ±1-2℃
Temperature Control Method P,I.D+SSR
Machine Control Method ndependent PLC+Brand/computer/touch screen buttons
Flux Capacity Max:5.2L
Flux Flow 10~100ml/min
Spray Method Stepper motor/+ST-6spraye
Power Supply 3sohase and 5-line mechanism 380V
Total Power max:16kw Max.20kw
Normal Operating Power Approx:3kw Approx:4kw
Gas Source 4~7KG/CM²
Welght Approx:800kg Approx.1000kg

Control system: Industrial touch screen+PLC+SSR control, man-machine dialogue function, with functions such as parameter setting, function operation, production counting, economical intelligent welding function.

Transportation system: The clause adopts a turbo-worm structure. The adjustment is stable, accurate and convenient. Synchronous board connection, the guide rail adopts a special process design to prevent the guide rail from deformina. Titanium alloy transport claws, reinforced wear-resistant stainless steel imitating deformation device. Titanium claws are automatically tensioned without deformation.

Spray system: The spray system is controlled by an SMC cylinder and the spray speed is automatically adiusted with the width of the PCB and the transportation speed. Imported high-density nozzles are used to ensure the uniformity of the spray. Optional flux recovery system to ensure environmental protection and health.

Solder furnace: lead-free furnace chamber, long life and high thermal stability. Adopt patented nozzle design, oxidation ≤ 2kg (8h), suitable for Sn/Ag/Cu, Sn/Cu and other kinds of lead-free solder soldering process, unique dross collection design, easy maintenance, tin furnace temperature control accuracy ± 1 ℃. The wave adopts infinitesimal frequency speed regulation and delayed start design to make the wave start more smoothly and the wave more flat.

Preheating system: Preheating system adopts hot air circulation preheating structure, modular design, precise temperature control, can meet the lead-free process curve of single-layer or multi-layer board with jig, drawer type design, more convenient maintenance

Cooling system: using forced air cooling, high-power fan design, cooling rate up to 4-6℃/s

KY-300 Medium Wave Soldering Machine

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