BGA Hot Air Soldering Rework Station Lead-Free Smart Repair Station WDS-750

Product Description:

Parameter of WDS-750

Power	6800W
Up heater power	1200W
Down heater power	1200W
IR heater power	4200W(2400W control)
Power supply	(Single Phase)  AC 220V±10 50Hz
Position way	Optical lens+ Vshape holder+laser positioning
Temperature control	High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material	High sensitive touch screen+temperature control module+PLC+step drive
PCB Size	Max:550×480mm
PCB Size	Min: 10×10mm
Thermo-couple Ports	4pcs
Chips magnification times	2-30
PCB thickness	0.5-8mm
BGA size	0.8mm-8cm
Min.chips pitch	0.15mm
Mounting BGA weight	1000G
Mounting precision	±0.01mm
Size	L670×W780×H850mm
Optical alignment lens	Motor drive can move front back right left
Weight	About 90kg

WDS-750 Features:

1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;

2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;

3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;

4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;

5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;

6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within  ±1 ℃；

7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;

8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;

9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;

10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).

Packing: