HOT Air BGA Rework Soldering Reballing station Machine WDS-620

 Technology Parameter:

Item	Specifications
Power	AC 110V/220V±10% 50/60Hz
Overall dimension	L650xW630xH850mm
PCB size	Max 450x390mm Min10x10mm
BGA size	Max 70*70mm Min 1*1mm
Warranty	3 years ( 1st year is free )
Certification	CE ISO
Total power	5300W
Upper heating power	1200W
Bottom heating power	1200W
Infrared heating power	2700W

Where WDS-620 can be used?
1. Watch / Mobile /Cell phone repair;

2. Notebook/ Laptop /Computer repair;

3. XBOX 360/PS2/ PS3/PS4 Wii and so on game console repair;

4. Othe SMD/SMT/IC BGA rework;

5. BGA VGA CPU GPU ECU and Car motherboard soldering desoldering;

6.BGA chips,QFP QFN chip,PC,PLCC PSP PSY rework. 

Main Feature:

Independent 3 heating zones temperature control system

1.The upper and lower hot air heating, which can heat up at the same time from the top of the component to the bottom of the PCB; bottom IR heating, temperature precision control within ±1℃.8 segment temperature control independently. 

2.Hot air district heating for BGA and PCB at the same time, and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element. 

 3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analyzed,set and correct on the touch screen at any time.

 

Precision optical alignment system

Using high definition and adjustable CCD color optical alignment system, beam split,amplification ,lessening,fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment, adjustable image contrast; equipped with 15” high definition LCD monitor.

 

Multi-functional and humanized operation system

1.Adopting the HD touch human-machine interface; upper heating head and mounting head designed 2 in 1; providing many kinds of titanium alloy BGA nozzle can be rotated in 360 degree for easy installation and replacement.
2.X,Y and R angle adopted micrometer fine-tuning, accuracy locating, precision can reach ±0.01mm.WDS-620 infrared heating SMD Soldering Station phone repair machine with optical alignment system